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Udemy - Microelectromechanical Systems III - Fabrication Fundamentals

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1 - Introduction

1. Introduction.en_US.srt

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15.2 KB

1. Introduction.mp4

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152.5 MB

2 - MEMS Materials and Process Landscape

3 - Core Microfabrication Processes

10. Oxidation and the Deal–Grove Model.en_US.srt

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5.7 KB

10. Oxidation and the Deal–Grove Model.mp4

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43.2 MB

11. Doping Diffusion vs Ion Implantation.en_US.srt

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4.8 KB

11. Doping Diffusion vs Ion Implantation.mp4

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50.2 MB

12. Wet vs Dry Etching (Isotropic vs Anisotropic).en_US.srt

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6.3 KB

12. Wet vs Dry Etching (Isotropic vs Anisotropic).mp4

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53.1 MB

4 - Micromachining Strategies

13. Bulk Micromachining Techniques.en_US.srt

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7.3 KB

13. Bulk Micromachining Techniques.mp4

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48.4 MB

14. Surface Micromachining Flow.en_US.srt

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6.5 KB

14. Surface Micromachining Flow.mp4

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34.5 MB

15. Sacrificial Layers and Release.en_US.srt

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7.4 KB

15. Sacrificial Layers and Release.mp4

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44.6 MB

16. Wafer Bonding Techniques.en_US.srt

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7.6 KB

16. Wafer Bonding Techniques.mp4

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68.6 MB

5 - High Aspect Ratio MEMS

17. LIGA Process Fundamentals.en_US.srt

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17. LIGA Process Fundamentals.mp4

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78.7 MB

18. X Ray Lithography and Electroforming.en_US.srt

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8.5 KB

18. X Ray Lithography and Electroforming.mp4

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94.6 MB

19. UV LIGA (SU 8) and Trade Offs.en_US.srt

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4.5 KB

19. UV LIGA (SU 8) and Trade Offs.mp4

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22.2 MB

20. Applications of High Aspect Ratio MEMS.en_US.srt

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20. Applications of High Aspect Ratio MEMS.mp4

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34.2 MB

6 - Packaging Testing and Reality

21. Why Packaging Dominates MEMS Cost.en_US.srt

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8.1 KB

21. Why Packaging Dominates MEMS Cost.mp4

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59.5 MB

22. Wafer Level vs Die Level Packaging.en_US.srt

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22. Wafer Level vs Die Level Packaging.mp4

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36.5 MB

23. Wire Bonding vs Flip Chip.en_US.srt

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5 KB

23. Wire Bonding vs Flip Chip.mp4

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31.9 MB

24. Testing MEMS Devices (Pressure Acceleration Fluids).en_US.srt

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5.8 KB

24. Testing MEMS Devices (Pressure Acceleration Fluids).mp4

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59.6 MB

25. Reliability Yield and Industrial Constraints.en_US.srt

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25. Reliability Yield and Industrial Constraints.mp4

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78.7 MB

7 - Closing

1. Final Assessment.html	HTML	10.1 KB
26. Closing.en_US.srt	SRT	3.8 KB
26. Closing.mp4	MP4	11 MB

8. Photolithography (Positive vs Negative).en_US.srt

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8. Photolithography (Positive vs Negative).mp4

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59.3 MB

9. Thin Film Deposition (CVD PVD Electroplating).en_US.srt

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9. Thin Film Deposition (CVD PVD Electroplating).mp4

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103 MB

4. MEMS Fabrication Categories.en_US.srt

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14.4 KB

4. MEMS Fabrication Categories.mp4

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152.3 MB

5. Silicon Polymers Ceramics and Carbon MEMS.en_US.srt

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5. Silicon Polymers Ceramics and Carbon MEMS.mp4

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135.9 MB

6. Bulk vs Surface Micromachining Overview.en_US.srt

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6. Bulk vs Surface Micromachining Overview.mp4

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127.7 MB

7. What MUMPs Is and Why It Exists.en_US.srt

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7. What MUMPs Is and Why It Exists.mp4

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47.6 MB

2. Course Structure & Syllabus.en_US.srt

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2. Course Structure & Syllabus.mp4

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40.5 MB

3. Specialization Options.en_US.srt

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3. Specialization Options.mp4

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35.2 MB

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Udemy - Microelectromechanical Systems III - Fabrication Fundamentals

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